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09 / 2012 - sentronics metrology presents: High Speed Wafer Metrology and Sorting System with Multi Sensor Technology

sentronics metrology has now enhanced the form and function of the already existing fully-automated wafer inspection systems: for example the newly engineered SemDex A with advanced design.
It is not only a powerful high speed metrology device but also a wafer sorter combined in one system. Therefore, SemDex A has now successfully captured the demand of the Asian market.

08 / 2017 - sentronics metrology at Semicon Japan

First held in 1977, SEMICON Japan has grown to become one of the largest international exhibition of semiconductor equipment and materials. Bringing companies and their technologies together with customers and partners, as well as providing a setting for technical seminars and meetings, SEMICON Japan actively supports the growth of the global semiconductor industry.

Dec 13-15, 2017
Tokyo Big Sight Tokyo, Japan, booth # 1532

 

03 / 2017 - sentronics metrology at Southeast Asia

While Southeast Asia is rising up fast as a world-class electronics manufacturing hub with end-to-end R&D capabilities - SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products and brings in the most up-to-date market and technology trends.
25.-27. April 2017, Penang, Malaysia at Regional Business Network, booth #807

Non-contact Optical Metrology Systems for Quality Assurance

Welcome to sentronics metrology GmbH

sentronics metrology is world leader in non-contact, non-invasive optical metrology. For over ten years sentronics metrology has been developing and marketing systems for seamless monitoring of quality processes in the areas of: wafers, automotive and coatings/ films.

Sensors developed by sentronics metrology on the basis of optical interferometry and the company’s turnkey inspection systems for quality assurance all permit three-dimensional measurements, either of material thicknesses or of surface topographies, including roughness values.