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SemDex 600 with multiple sensor configurations

SemDex 600 with multiple sensor configurations
SemDex 600 with multiple sensor configurations

SemDex 600

Semi-Automated Wafer Inspection System 

Panel Level Packaging paves the way for a significant cost reduction in FOWLP processes. SemDex 600 is a semi-automated inspection system for fully automated non- contact measurement of manually loaded panels up to 600 mm x 600 mm. Additionally, framed and  unframed wafers of different materials up to 450 mm can be investigated. The unique chuck design allows for easy and safe panel handling.

Total thickness / TTV after the molding and / or grinding process can be measured with a sub-µm accuracy. The system is capable of measuring multi-layers, including the substrate layer, in a single pass. Further process steps can be monitored, e.g. RDL structures or PI thickness. An additional topography sensor makes the detection of surface roughness down to nm level possible. A pattern based location finding software offers the possibility to recognize and measure at specific positions.


  • Total- and multi-layer thicknesses with sub-µm accuracy
  • Bow / Warp with µm accuracy
  • Roughness in sub-nm range
  • Coating thickness
  • RDL pad dimensions

  • High flexibility: 4”, 6”, 8”, 12” wafer, panels up to the size of 600 mm x 600 mm
  • Simultaneous measurements possible in one step
  • Measures both framed and unframed wafers
  • SEMI S2- and S8-compliant ergonomics
  • Upgradable
  • User-friendly WaferSpect software


  • Vacuum chuck, also for measurement of both sides
  • Available with high-resolution HD CMOS camera and pattern recognition software