SemDex 600

Panel Level Packaging paves the way for a significant cost reduction in FOWLP processes. SemDex 600 is a semi-automated inspection system for fully automated non- contact measurement of manually loaded panels up to 600 mm x 600 mm. Additionally, framed and  unframed wafers of different materials up to 450 mm can be investigated. The unique chuck design allows for easy and safe panel handling.

Total thickness / TTV after the molding and / or grinding process can be measured with a sub-µm accuracy. The system is capable of measuring multi-layers, including the substrate layer, in a single pass. Further process steps can be monitored, e.g. RDL structures or PI thickness. An additional topography sensor makes the detection of surface roughness down to nm level possible. A pattern based location finding software offers the possibility to recognize and measure at specific positions.

Applications

• Total- and multi-layer thicknesses with sub-µm accuracy
• Bow / Warp with µm accuracy
• Roughness in sub-nm range
• Coating thickness
• RDL pad dimensions
  
  Benefits

• High flexibility: 4”, 6”, 8”, 12” wafer, panels up to the size of 600 mm x 600 mm
• Simultaneous measurements possible in one step
• Measures both framed and unframed wafers
• SEMI S2- and S8-compliant ergonomics
• Upgradable
• User-friendly WaferSpect software

Optional:

• Vacuum chuck, also for measurement of both sides
• Available with high-resolution HD CMOS camera and pattern recognition software