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SemDex A32

SemDex A32

SemDex A32 - 2 FOUPs
SemDex A32
SemDex A32
SemDex A32 - 2 FOUPs
SemDex A32
SemDex A21
Automatic loading of 200 mm (8") wafers

SemDex A31/A32

Fully-automated High Speed Wafer Inspection System with Multi Sensor Technology


SemDex A31/A32 is a fully automated wafer inspection system to measure wafers up to 300 mm (12“), including Taiko wafers. Manual loading is possible, even with framed wafers. One or two robot arms provide high through-put handling.
A rotary stage provides continuous 360° rotation for very fast acquisition rates. Substrate-layer thickness/ TTV or the total thickness of a stacked wafer, bow/ warp and flatness of a wafer can be determined with sub-µm accuracy in a single measuring run. Surface roughness can also be determined down to nm level. Furthermore TSV, RST and mini-bump parameters can be retrieved.

Intuitive WaferSpect software serves for measurement planning by means of recipes, execution of the measuring tasks including data processing, and saving/ export of the relevant measurement and parameter data.
Optionally the SEC/GEM 300 software package can be offered.


  • High flexibility: 6”, 8”, 12” wafer
  • Simultaneous measurements possible in one step
  • Very high throughput rate - up to 100 wafers/hr
  • Rotary stage for high precision and high speed measurements


  • Vacuum chuck, also for measurement of both sides
  • Available with high-resolution HD CMOS camer and pattern recognition software
  • SECS/GEM 300 software package