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SemDex A32

SemDex A32

Production inspection in a clean room

Bow/ Warp, Flatness with µm accuracy

Wafers thicker than 700 µm are comparatively resistant to external influences or coatings exerting a negative influence on their geometry. However, such effects cannot be neglected in the case of very thin wafers. 

Bow/ Warp, Flatness with µm accuracy

Geometric quality criteria such as bow or warp play a crucial role here. Measurement is performed with the thin wafers placed on three pins. The wafers are distorted as a result of their internal structure. Additional layers of material applied to the wafer generally modify the mechanical properties of the blank. Such mechanical stresses can be determined before and after coating with the aid of the integrated Stoney equation by performing a bow/warp measurement with a StraDex f sensor fitted in a SemDex wafer-inspection system.

Measuring systems for:

Bow/ Warp, Stress