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SemDex M1

SemDex M - modular system that can be used as a stand-alone semi-automated metrology system (M1) or fully-automated tool with one (M2) or two (M3) attached automation modules to handle 6”, 8” and 12” wafers or frames
SemDex M1
SemDex M - modular system that can be used as a stand-alone semi-automated metrology system (M1) or fully-automated tool with one (M2) or two (M3) attached automation modules to handle 6”, 8” and 12” wafers or frames
SemDex M2
Fully-automated System with Measurement and Wafer Handling Module

SemDex M

Modular Metrology System

The flexible SemDex M is the base platform for a wide range of semiconductor metrology applications. Diverse measurement configurations and handling options are possible using different sensors, measurement stages and automation hardware.

SemDex M is a modular system that can be used as a stand-alone semi-automated metrology system (M1) or fully-automated tool with one (M2) or two (M3) attached automation modules to handle 6”, 8” and 12” wafers or frames.

Each module is configured flexibly to provide a customized sensor and automation configuration for each specific requirement. Select the sensors, stage and chuck type suitable for your metrology applications and solve your handling requirements by choosing appropriate components from a wide range of robots, endeffectors, load ports and pre-aligners for the automation module. To enhance the productivity or fulfill future requirements each SemDex M system can be upgraded on-site with additional modules with a minimum effort and lowest tool down time.

Applications

The SemDex M provides reliable, high-precision non-contact measurements of wafer and multi-layer thickness, bow, warp or roughness. One or multiple integrated StraDex f sensors measure substrate-layer thickness, TTV or the total thickness of a stacked wafer, TSV parameters like via depth or RST as well as bow, warp and flatness with sub-µm accuracy.

The optional white light interferometer StraDex a allows to measure surface roughness down to nm level as well as micro topography features like mini-bump dimensions, step height or groove depth.

Options

• Open aperture or vacuum chuck
• Supports linear stages up to 465 x 350 mmor rotational stage
• Optional high-resolution HD CMOS camera and pattern recognition software
• Wafer or frame handling module, or both
• Fan filter unit with different filter types for each module 

Benefits

• Modular, upgradable system
• Multiple metrology applications integrated into one tool
• Flexible configuration solutions for all handling requirements
• On-site automation upgrade for semi-automated systems